Contact Us
Company Information
| Company Name | Orilind Limited Company |
|---|---|
| Website | https://multilayerpcb.store.bossgoo.com/ |
| Operational Address | Shajing road 613#,Darun technology building,Bao'an District,Shajing,Shenzhen City, |
Orilind Limited Company
Orilind Limited Company
Toptechpcb is a leadingmanufacturer of solutions that provide high quality quick turn, small and medium-sized volume PCB for domestic and foreign hi-tech enterprises andresearch institutions , mainly provides Single-layer to Multilayer PCB ranged from prototype sample and small medium quantity.
At toptechpcb, we are understandsyour technical challenges. Whether you need quick prototypes, a cost effective solution for your rigid, rigid-flex, mixed dielectrics , we have theexperience, the people and the technology to meet these challenges. We competein time and must go beyond our current boundaries to provide competitive PCB`s and services outside what is considered normal service.
Toptechpcb prides itself inbeing a Total Solutions Provider and manufactures quality rigid, metal-backedand flex printed circuit boards on various types of substrates for a variety ofapplications. These products can go into high speed computing, high frequency telecommunicationranging, defense, LEDs and other heat sink automotive electronics, and navigationdevices – right from small test and prototype quantities to large volumeproduction. We provide all of our technologies in a time critical environment.
At Toptechpcb, quality is a wayof life. The staff is made up of world class, highly experienced Ph.D.materials scientists, engineers, Six Sigma black belts, and several Six Sigmagreen belt candidates undergoing training. Toptechpcb hasstate-of-the-art process control system sand our certifications include ISO9001:2008 and QS2000 series. We have rigorous SPC controls, automated opticalinspection, metallographic cross section and electrical test facilities. Theseprovide the quality assurance needed to meet the high standards of our customers
Production Capabilities
Layers count: 50
Rigid-Flex Board
Mass production capacity for high density rigid-flex board fabrication
HDI
3+C+3: Mass production
4+C+4:Small volume﹠Mass production
Laser via(Plugging via):Mass production
Min microvia hole size(mil) :4
Metal substrate board
Layers count:Metal substrate: 1-12L
Embedded metal/Heat sink/Sweat bonding: 2-24L
Ceramic substrate: 1-2L
Board thickness :0.5-7.0mm
Size:max:610*610 mm ,min:5*5mm
Mechanic: X/Y/Z tolerance±0.03mm, speaker hole, screw hole
Thermal conductivity: Standard materials: 1-4W/m.k,
Specified materials : 5-12W/m.k
Ceramic materials: 24-170W/m.k
Max copper thickness:28OZ
Metal partial surface treatment: Anodic oxidation, Hard anodic oxidation coating, Chemical passivation, Sandblasting, Wire drawing, Al electroplating
Surface treatment: Leaded HASL/Lead free HASL, OSP, ENIG, ENEPIG, Plating(Ni)Soft/Hard gold, Immersion Sn, immersion silver, Organic Coating
Type: Pre-bonding, Postbonding, Sweat bonding, Metal substrate, Embedded metal, Heatsink,Ceramic substrate
Min Line width/spacing(mil): 3.0/3.0
Max Aspect Ratio: 40:1
Board thickness(mil): 0.2mm~8.0mm
Max Panel size: 22.5″* 49″
Material: FR-4,High Tg FR-4,Halogen free,High Frequency
(Rogers,Arlon,Taconic,Nelco...)etc.
Surface Treatment: HASL,ENIG,ENEPIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Lead free HASL etc.
Layer Count/flex layer:36/10Min Line width/spacing for inner layer(mil): 3.0/3.0Max Aspect Ratio: 20:1Min Hole size(mil): 6Impedance control:10%
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